SAN JOSE, Calif. – November 13, 2023
| What: | Rambus Demonstrates CXL Platform Development Kit Enabling Memory Tiering for AI Infrastructure | |
| Who: | Rambus Inc. (Nasdaq: RMBS), a premier chip and silicon IP provider | |
| Where: | Supercomputing 2023 (SC23) at the CXL Consortium Booth (Booth #1301) at the Colorado Convention Center in Denver, CO | |
| When: | November 14 -16, 2023. Exhibition begins at 10:00 a.m. MT. |
This week at SC23, Rambus will demonstrate a CXL platform development kit (PDK) that enables module and system makers to prototype and test CXL-based memory expansion and pooling solutions for AI infrastructure and other advanced systems. The demonstration will show CXL memory tiering functionality in a production server running industry-standard benchmarking software.
The Rambus CXL PDK is interoperable with CXL 1.1 and CXL 2.0 capable processors and memory from all the major memory suppliers. It leverages today’s available hardware to accelerate the development of the full stack of next-generation CXL-based solutions (device, module, system and software).
The Rambus CXL PDK includes:
- CXL hardware platform (add-in card), featuring Rambus CXL memory controller chip prototype
- Advanced debug and visualization tools
- CXL-compliant management framework and utilities
- Fully customizable SDK for value-added features and vendor-specific commands
Join Rambus at SC23 in the CXL Consortium Booth (Booth 1301) to see the CXL PDK demonstration in action.
To learn more about SC23, visit https://www.rambus.com/event/sc23-supercomputing-2023/. To learn more about the Rambus CXL PDK, visit https://www.rambus.com/cxl-memory-initiative/.
