Dr. Steven Woo, distinguished inventor and fellow at Rambus will be moderating an upcoming panel at the AI Hardware Summit on Tuesday, September 12th, 2023 starting at 3:00pm PT at the Santa Clara Marriott.
Memory continues to be a critical bottleneck for AI/ML systems, and keeping the processing pipeline in balance requires continued advances in high performance memories like HBM and GDDR, as well as mainstream memories like DDR. Emerging memories and new technologies like CXL offer additional possibilities for improving the memory hierarchy. In this panel, we’ll discuss important enabling technologies and key challenges the industry needs to address for memory systems going forward. Hear fellow ecosystem leaders from Microsoft and AMD discuss these critical topics.
We look forward to seeing you at AI Hardware Summit! And if you can’t make it, but are interested in reading about what happens, stay tuned for our recap blog after the event!
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