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Home > Press Releases > Corporate > Media Alerts > Media Alert – Rambus to Present New Innovations and Demonstrate High-Speed Memory Technologies at DesignCon

Media Alert – Rambus to Present New Innovations and Demonstrate High-Speed Memory Technologies at DesignCon

LOS ALTOS, CALIFORNIA, UNITED STATES – 02/03/2009

Who: Rambus Inc. (Nasdaq: RMBS)
Where: DesignCon
Booth #205
Santa Clara Convention Center
5001 Great America Pkwy
Santa Clara, CA 95054
When: February 2-5, 2009

 

Join Rambus at DesignCon 2009 for papers, demonstrations, and displays of its high-performance memory technology innovations including:

Rambus Demos and Displays

    • The Mobile Memory Initiative featuring a silicon test vehicle achieving 4.3Gbps data rate at best-in-class power efficiency.

 

    • The award-winning XDR™ memory architecture implemented in an ultra low-cost LQFP package operating at up to 3.2Gbps.

 

  • The XDR2 memory architecture, the world’s fastest memory system solution, operating at 12.8Gbps featuring Fully Differential Memory Architecture (FDMA), FlexLink™ C/A and Enhanced FlexPhase™ circuit technology.

Rambus Papers

    • 6-TPI, Analyzing Signal and Power Integrity Limitations for Mobile Memory Systems in PoP Environments
      Tuesday, February 3, 2:00 pm – 2:40 pm

 

    • 4-WA1, Feasibility of Multi-Gigabit Memory Interface in LQFP Packages
      Wednesday, February 4, 8:30 am – 9:10 am

 

    • 10-WAI, Prediction and Measurement of Supply Noise-Induced Jitter in High-Speed I/O Interfaces
      Wednesday, February 4, 8:30 am – 9:10 am

 

    • 6-WA2, Clock Jitter Reduction in High-Speed Interfaces
      Wednesday, February 4, 9:20 am – 10:00 am

 

    • 9-WA3, Pseudo-Differential Vector Signaling for Noise Reduction in Single-Ended Signaling Systems
      Wednesday, February 4, 10:15 am – 10:55 am

 

  • 6-WP1, The Design and Signal Integrity Analysis of a TB/s Memory System
    Wednesday, February 4, 2:00 pm – 2:40 pm

About Rambus Inc.

Rambus is one of the world’s premier technology licensing companies specializing in the invention and design of high-speed memory architectures. Since its founding in 1990, the Company’s patented innovations, breakthrough technologies and renowned integration expertise have helped industry-leading chip and system companies bring superior products to market. Rambus’ innovations and solutions enable unprecedented performance in computing, communications, and consumer electronics applications. Rambus licenses both its world-class patent portfolio as well as a range of leadership and industry-standard memory solutions. Headquartered in Los Altos, California, Rambus has regional offices in North Carolina, India, Germany, Japan, and Taiwan. Additional information is available at www.rambus.com.

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