Press Releases Archives

James Mitarotonda Joins Rambus Board of Directors

March 16, 2021

SAN JOSE, Calif., March 16, 2021 —Rambus Inc. (NASDAQ: RMBS), a provider of industry-leading chips and silicon IP making data faster and safer, today announced that James Mitarotonda joined its Board of Directors as a Class I director with a term expiring at Rambus’ 2022 annual meeting of stockholders. Mr. Mitarotonda currently serves as chairman, president and chief executive officer of Barington Capital Group, L.P. (“Barington”), an investment firm. Mr. Mitarotonda has extensive financial and executive leadership expertise, as well

Mixel, Rambus and Hardent Collaborate to Deliver State-of-the-Art Integrated MIPI Display Subsystem Solution

March 10, 2021

Highlights: Leaders in MIPI® technology join forces to offer a complete display subsystem solution with best-in-class bandwidth efficiency Integrated solution includes PHY, digital controller and VESA Display Stream Compression (DSC) to deliver maximum MIPI DSI-2SM functionality and operational modes Proven, reusable IP solution lowers implementation risk and accelerates time to market Solution enables higher resolutions and frame rates for mobile, AR/VR and automotive display applications SAN JOSE, CA, and MONTREAL, QC – March 10, 2021 – Mixel, Inc., a leading provider

Rambus and AMD Extend Patent License Agreement

February 24, 2021

SAN JOSE, Calif. – February 24, 2021 – Rambus Inc. (NASDAQ: RMBS), a provider of industry-leading chips and silicon IP making data faster and safer, today announced that it has extended its patent license agreement with Advanced Micro Devices, Inc. (NYSE: AMD). Under the terms of the agreement, AMD will continue to be licensed for its products. Specific terms of the agreement are confidential. “We are very pleased that AMD has chosen to renew its patent license agreement and look forward to

Rambus Reports Fourth Quarter and Fiscal Year 2020 Financial Results

February 1, 2021

Delivered strong Q4 results, in line with revenue and exceeding profitability expectations Beat 2020 guidance for annual revenue and earnings Generated $185.5 million in cash provided by operating activities for the full year, up 44% year over year Record annual product revenue of $114.0 million driven by Memory Interface Chips, up 56% year over year SAN JOSE, Calif. – February 1, 2021 – Rambus Inc. (NASDAQ:RMBS), a provider of industry-leading chips and IP making data faster and safer, today reported

Rambus Initiates Accelerated Share Repurchase Program

November 12, 2020

SAN JOSE, Calif. – November 12, 2020 – Rambus Inc. (NASDAQ: RMBS), a premier silicon IP and chip provider making data faster and safer, today announced it has initiated an accelerated share repurchase program with Deutsche Bank AG, London Branch as counterparty, through its agent Deutsche Bank Securities Inc. (Deutsche Bank) to repurchase an aggregate of approximately $50 million of its common stock, with an initial delivery of approximately 2.7 million shares. “This program is part of a balanced approach to delivering

Rambus Reports Third Quarter 2020 Financial Results

November 2, 2020

Strong quarter, delivering on revenue, exceeding expectations for profit and generating $44.1 million in cash provided by operating activities Memory interface chip quarterly revenue up 39% year over year; on track for over 50% full-year growth Micron DRAM license extended for an additional 4 years New stock repurchase program authorizes repurchase of 20 million shares SAN JOSE, Calif. – November 2, 2020 – Rambus Inc. (NASDAQ:RMBS), a premier silicon IP and chip provider making data faster and safer, today reported

Rambus Announces New Stock Repurchase Program

November 2, 2020

Board of directors authorizes repurchase of up to 20 million shares SAN JOSE, Calif. – November 2, 2020 – Rambus Inc. (NASDAQ: RMBS), a premier silicon IP and chip provider making data faster and safer, today announced that its board of directors has approved a new stock repurchase program authorizing the repurchase of up to 20 million shares. “The company has a long history of strong, sustained cash generation that provides a foundation for long-term growth, both organically and inorganically,” said Luc

Rambus IPsec Packet Engine Secures 5G Networking at 10 Gbps

October 27, 2020

Highlights: Internet Protocol Security (IPsec) Packet Engine with integrated Data Plane Development Kit (DPDK) and companion key negotiation toolkit provides complete solution for securing 5G networking from 1 to 10 Gbps data rates Easily integrates into SoCs for 5G base stations, core network, gateways and end points Supports 3GPP, TLS, DTLS protocols, all relevant IPsec RFCs, and NIST-compliant algorithms SAN JOSE, Calif. – Oct. 27, 2020 – Rambus Inc. (NASDAQ: RMBS), a premier silicon IP and chip provider making data faster and safer, today

Rambus Advances HBM2E Performance to 4.0 Gbps for AI/ML Training Applications

September 9, 2020

Highlights: Fully-integrated HBM2E memory interface solution, consisting of verified PHY and controller, achieves industry’s fastest performance New benchmark in performance supports accelerators requiring terabyte-scale bandwidth for artificial intelligence/machine learning (AI/ML) training applications Partners with SK hynix and Alchip to develop 2.5D HBM2E memory system solution using TSMC N7 process and CoWoS® advanced packaging technologies Offers unrivaled system expertise supporting customers with interposer and package reference designs to speed time to market Read first our primer on: HBM2E Implementation & Selection –

Rambus and Micron Extend Patent License Agreement

September 3, 2020

SAN JOSE, Calif. – Sept 3, 2020 – Rambus Inc. (Nasdaq: RMBS), a premier silicon IP and chip provider making data faster and safer, today announced it has extended its patent license agreement with Micron for an additional four years. The extension maintains the existing financial terms of the agreement and provides Micron with a license to the extensive portfolio of Rambus patents until December 1, 2024. “We are very pleased Micron has extended their patent license agreement and with

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