Rambus

At Rambus, we create cutting-edge semiconductor and IP products, spanning memory and interfaces to security, smart sensors and lighting.

Home > Press Releases > Corporate > Technology

Technology

Rambus and AMD Extend Patent License Agreement

SAN JOSE, Calif. – February 24, 2021 – Rambus Inc. (NASDAQ: RMBS), a provider of industry-leading chips and silicon IP making data faster and safer, today announced that it has extended its patent license agreement with Advanced Micro Devices, Inc. (NYSE: AMD). Under the terms of the agreement, AMD will continue to be licensed for its products. Specific terms of the agreement are confidential.

“We are very pleased that AMD has chosen to renew its patent license agreement and look forward to our continued collaboration in the future,” said Kit Rodgers, senior vice president of technology partnerships and corporate development at Rambus. “As our fourth continuous agreement with AMD, this extension is a testament to the ongoing strength and relevance of our patent portfolio.”

Rambus Develops R+™ DDR4/3 PHY on Samsung 28nm LPP Process

Design achieves both high-performance and high-efficiency for networking, computing, and consumer applications

SUNNYVALE, Calif. – February 10, 2015 – Rambus Inc. (NASDAQ:RMBS) today announced it has developed an R+™ DDR4/3 PHY on the Samsung 28nm LPP process. Through the collaboration with Samsung, Rambus has achieved a robust, production-ready R+ DDR4/3 PHY on the power-performance optimized 28nm Low Power Plus (LPP) process. The Rambus design has been characterized at a system level, and can be easily integrated into a SoC.

“With the ongoing demand for data alongside the cloud driving more and more networking, the need for faster speeds and better bandwidth has never been more prevalent,” said Kevin Donnelly, general manager of the Memory and Interface division at Rambus. “Successfully taping out a production-ready R+ DDR4/3 PHY on the Samsung 28nm LPP process is a major step in our strategic and valued partnership. Together we are breaking the necessary ground to achieve the best possible speeds and bandwidth required by today’s consumer and networking devices.”

The Rambus R+ DDR4 multi-modal memory PHY enables customers to differentiate their offerings by providing industry-leading performance while maintaining full compatibility with industry standard DDR4, and DDR3 interfaces. Designed for server, compute, networking and consumer applications, the R+ DDR4 PHY delivers versatile configuration options for both area/power optimized consumer applications and performance intensive compute applications. The DDR4 IP product supports data rates from 800 to 3200Mbps in a low-power process and is available in both PoP and discrete packages “Our high-volume 28nm LPP technology gives SoC designers a robust manufacturing option for a new generation of feature-rich consumer devices.” said Shawn Han, Vice President of Foundry Marketing, Samsung. “We are pleased to be collaborating with Rambus to demonstrate the capabilities of Samsung’s 28nm processes and the design enablement ecosystem available for Samsung’s foundry customer and IP partners.”

The R+ DDR4/3 design leverages the wide range of design enablement support and expertise that Samsung offers, including process design kits (PDKs), DFM kits, analog mixed signal reference flow, extensive implementation services, and silicon proven logic libraries. Rambus also utilized Samsung’s foundry assembly support resources to provide a flip-chip packaging option on the high speed PHY design. In addition, Samsung’s 28nm Low-Power (LP) Gate First High-k Metal Gate (HKMG) process offers considerable power and performance advantages to a growing spectrum of mobile, consumer and IT infrastructure-computing applications.

Follow Rambus
Company website: rambus.com
Rambus blog: rambusblog.com
Twitter: @rambusinc
LinkedIn: www.linkedin.com/company/rambus
Facebook: www.facebook.com/RambusInc

About Rambus Inc.
Rambus brings invention to market. Our customizable IP cores, architecture licenses, tools, services, and training improve the competitive advantage of our customer’s products while accelerating their time-to-market. Rambus products and innovations capture, secure and move data. For more information, visit rambus.com.

Tezzaron to Incorporate Rambus ReRAM Memory Technology

Architecture enhances power and performance in military, aerospace and commercial applications

SUNNYVALE, Calif. and Naperville, Ill. – January 22, 2015 – Rambus Inc. (NASDAQ:RMBS) and Tezzaron Semiconductor today announced that they have signed an agreement to incorporate Rambus oxide-resistive memory (ReRAM) technology in forthcoming Tezzaron devices. This architecture license gives Tezzaron access to system IP, specifications and validation suites to design differentiated chips using ReRAM, which is ideally suited to improve the power and performance requirements in military, aerospace, and commercial memory applications.

“Rambus is a great company to work with and their ReRAM technology is a game-changer,” said Bob Patti, chief technology officer at Tezzaron. “By implementing ReRAM in our unique 3D architecture, we can revolutionize high-performance computing with better endurance and superior power efficiency.”

“At Rambus we are continually developing comprehensive memory solutions that take into account the evolving needs of an increasingly diverse market,” said Gary Bronner, vice president of Rambus Labs. “ReRAM fills the gap between what DRAM and Flash can provide while being highly reliable and high speed. Collaboration with Tezzaron takes full advantage of this new technology by differentiating the memory architecture for numerous use cases across the embedded landscape.”

Tezzaron plans to build ReRAM into storage-class 3D memory devices for military, aerospace and commercial applications. Tezzaron also plans to implement ReRAM in an assortment of SoCs, FPGAs and processors to exploit the extensive split-fab production experience of Tezzaron’s fabrication subsidiary, Novati Technologies. Using ReRAM, Novati can add hundreds of megabytes of storage to a logic device manufactured in a standard commercial fab.

In addition to military and aerospace applications, ReRAM technology can be utilized in a variety of embedded storage memory devices where low power, design integration, cost and performance are all important factors. Among these, the development of storage memory in connected devices is fast becoming critical.

The first in Tezzaron’s family of ReRAM devices is currently in design and is scheduled for production in 2016.

Follow Rambus
Company website: rambus.com
Rambus blog: rambusblog.com
Twitter: @rambusinc
LinkedIn: www.linkedin.com/company/rambus
Facebook: www.facebook.com/RambusInc

About Rambus Inc.
Rambus brings invention to market. Our customizable IP cores, architecture licenses, tools, services, and training improve the competitive advantage of our customer’s products while accelerating their time-to-market. Rambus products and innovations capture, secure and move data. For more information, visit rambus.com.

About Tezzaron Semiconductor
Tezzaron is a full service turn-key supplier of 3D and 2.5D memory, memory subsystems and memory-intensive SoCs. Tezzaron specializes in 3D wafer and die stacking, TSV processes and wide-ranging collaborations, creating commercial parts as well as custom devices for prototyping and production. For more information, visit www.Tezzaron.com.

About Novati Technologies
Novati Technologies, a wholly owned subsidiary of Tezzaron, is the premier innovation partner for accelerating nanotechnology development and commercialization. Novati’s proven advanced technology and secure IP infrastructure, combined with its recognized Technology Development Process, supports companies developing MEMS, microfluidics, novel transistors, photovoltaics and other nanotechnologies for the semiconductor, life sciences and aerospace and defense markets. For more information, visit www.Novati-Tech.com.

Press contacts:
Sam Katzen
MSLGROUP for Rambus
(415) 512-0770
[email protected]

Rambus Unveils On-chip Noise Monitor to Improve Quality and Reduce Time-to-Market of Complex SoCs

Compact IP enables accurate characterization of power supply noise in mobile and server applications

SUNNYVALE, Calif. – January 20, 2015 – Rambus Inc. (NASDAQ:RMBS) today announced the addition of an On-chip Noise Monitor to its suite of tools and IP cores. The Noise Monitor is a compact IP block that enables easy and precise noise measurements for both low-power mobile and high-performance server SoCs. Embedded on-chip, the noise monitor eliminates the need to use slow and often error-prone hand-probing techniques, improving the quality of silicon test results and speeding time-to-market.

“As the system requirements for smartphones, tablets and servers continue to drive higher data rates and reduced power, designers are facing increasingly difficult challenges to accurately measure and characterize SoC power supply noise,” said Kevin Donnelly, general manager of the Memory and Interface division at Rambus. “The fast and accurate results delivered by the On-chip Noise Monitor provide designers a better understanding of the affects of noise and circuit performance and an increased confidence in the quality of IC design.”

The Noise Monitor is an extremely small IP block that is integrated directly into the complex IC capable of measuring noise at frequencies as high a 6 gigahertz (GHz). This makes it ideal for high data rate applications, as well as those that use package-on-package and 2.5/3D packaging. When coupled with the Rambus LabStation™ Validation Platform, designers are able to precisely measure multiple aspects of power supply noise using only the LabStation Interface Module (LIM) and a personal computer.

Rambus will be demonstrating the On-chip Noise Monitor along with its R+™ enhanced standard memory and serial link cores at the upcoming DesignCon 2015 conference in booth 835, January 28-29, 2015.

Follow Rambus

Follow Rambus
Company website: rambus.com
Rambus blog: rambusblog.com
Twitter: @rambusinc
LinkedIn: www.linkedin.com/company/rambus
Facebook: www.facebook.com/RambusInc

About Rambus Inc.
Rambus brings invention to market. Our customizable IP cores, architecture licenses, tools, services, and training improve the competitive advantage of our customer’s products while accelerating their time-to-market. Rambus products and innovations capture, secure and move data. For more information, visit rambus.com.

Rambus and Mobiveil Partner to Bring Pre-Validated Solution to Chip Makers, Delivering Memory Flexibility and Accelerated Time-to-Market

Certified interoperability of DDR4/3, LPDDR3/2 Multi-modal PHY and Universal controller combines industry-leading signal integrity and broad configurability

SUNNYVALE and MILPITAS, Calif. – November 18, 2014 – Rambus Inc. (NASDAQ:RMBS) and Mobiveil today announced they have validated interoperability of the Rambus R+™ DDR4 Multi-modal PHY with the Mobiveil Universal Multiport Memory Controller (UMMC) Core for JEDEC standard DDR4/3 and LPDDR3/2 operation. As part of the overall Rambus IP Cores program, the integrated IP provides chipmakers with a pre-validated, industry standard solution that reduces costs and risk by reducing IP qualification time. In addition, the differentiated memory subsystem brings together the superior signal integrity and low power offered by the Rambus R+ multi-modal PHY with the flexibility of the Mobiveil UMMC in a single, easily integrated solution.

“Partnering with Mobiveil to bring a complete offering to market demonstrates both companies’ commitment to meeting customer needs in the face of increasingly complex and costly SoC development,” said Kevin Donnelly, general manager of the Memory and Interface division at Rambus. “By working in a collaborative manner with companies like Mobiveil, we are addressing chip makers needs with proven and ready-to-use IP blocks that minimize qualification and integration time.”

“Our UMMC Controller Core has successfully proven to be both flexible and configurable for real-time consumer applications,” said Ravi Thummarukudy, chief executive officer of Mobiveil. “Pairing our technology with the Rambus R+ multi-modal PHY provides customers with the best DRAM solution for their particular application without changing the SoC, which substantially minimizes design time and development cycles across a broad number of applications.”

The Rambus R+ DDR4/3, LPDDR3/2 multi-modal PHY delivers industry-leading performance while providing SoC makers a comprehensive array of memory choices, ranging from high-performance to low-power applications. To complement its broad applicability, the R+ DDR4/3 multi-modal PHY delivers versatile configuration options for both area- and power-optimized consumer applications and performance-intensive compute applications. Additionally, the enhanced standards IP cores are designed with system-aware methodology to ensure superior signal integrity and system margin for optimal DRAM vendor interoperability. The PHY is available in several low-power foundry processes and can be configured for both flip-chip and wire bond packages with data rates ranging from 800 to 3200Mbps.

Mobiveil’s UMMC Controller is a highly flexible and configurable design. It is targeted for high bandwidth access and low power consumption such as next-generation mobile, networking and consumer applications. The controller architecture is carefully tailored to achieve reliable high-frequency operation with dynamic power management and rapid system debug capabilities. Its flexible AXI System interface makes it easy to be integrated into a wide range of applications.

Mobiveil has joined the Rambus Partner Program, which will enable further collaboration on other combined IP blocks offerings between the two companies. For additional information on the Rambus Partner Program, visit rambus.com/partners.

Follow Rambus
Company website: rambus.com
Rambus blog: rambusblog.com
Twitter: @rambusinc
LinkedIn: www.linkedin.com/company/rambus
Facebook: www.facebook.com/RambusInc

About Rambus Inc.

Rambus brings invention to market. Our customizable IP cores, architecture licenses, tools, services, and training improve the competitive advantage of our customer’s products while accelerating their time-to-market. Rambus products and innovations capture, secure and move data. For more information, visit rambus.com.

About Mobiveil, Inc.

Mobiveil is a fast‐growing technology company that specializes in development of Silicon Intellectual Properties, platforms and solutions for the storage, networking and enterprise markets. Mobiveil team leverages decades of experience in delivering high‐quality, production‐proven, highspeed serial interconnect Silicon IP cores and custom and standard form factor hardware boards to leading customers worldwide.. Mobiveil is headquartered in the Silicon Valley with engineering development centers located in Milpitas, CA, Chennai and Bangalore, India, and sales offices and representatives located in US, Europe, Israel, Japan, Taiwan and People Republic of China. For more information, please visit www.mobiveil.com

Rambus Cryptography Research Division Launches Suite of DPA Resistant Cores Addressing the Continuing Rise in Data Theft

Enables easy-to-integrate countermeasures as further deterrent to side-channel attacks

SUNNYVALE, Calif. – September 30, 2014 – Rambus Inc. (NASDAQ:RMBS), today announced that its Cryptography Research division has introduced a family of differential power analysis (DPA) resistant cryptographic cores. As part of Rambus’ overall IP cores program, these ready-to-use IP cores offer chipmakers an easy-to-integrate security solution with built-in side channel resistance for cryptographic functions across a wide range of connected devices. Leading with high-performance AES cryptographic cores, these DPA resistant solutions provide SoC manufacturers with a seamless solution that enables them to devote resources to differentiating features and reduce implementation time.

“Instances of data theft are increasing at an alarming rate,” said Dr. Simon Blake-Wilson, vice president of Products and Marketing of the Rambus Cryptography Research division. “These threats highlight the vulnerability of valuable and sensitive data in all of our connected devices. By enhancing today’s standard cryptographic cores with robust DPA resistance, we ensure our customers have a higher level of protection with validated solutions.”

DPA attacks use variations in the electrical power consumption or RF emissions of a targeted device to derive secret keys from crypto algorithms. Many industries, including payments, content protection and defense, now require that chipsets include protection against DPA attacks. By packaging DPA countermeasures into cryptographic IP cores, robust DPA resistance can now be easily integrated into SoCs using hardware cores or software libraries. These solutions provide flexible side-channel resistance validated to different security and performance levels based on product requirements.

As one of the most widely used encryption algorithms for both commercial and government applications, the initial offering includes both 128- and 256-bit AES cryptographic cores. The product roadmap includes a full suite of solutions across all standard algorithms, such as 3DES, ECC, SHA, and government-recommended Suite B. These cores are validated to resist first- and second-order DPA attacks up to 10 million traces and can be optimized for size, speed, and security level, based on customer requirements.

Having discovered side-channel attacks, Cryptography Research scientists have developed a comprehensive portfolio of application-specific hardware core and software library solutions that chipmakers can use to build DPA resistant products. These DPA resistant solutions can be integrated into a wide range of SoCs, including power-sensitive mobile applications, highly secure anti-tampering and performance-driven multi-core processors. These cores and libraries are accompanied by a variety of tools, such as the DPA Workstation™, as well as services and system IP to help chipmakers improve system margins, reduce cost, focus on product differentiation and speed time-to-market.

Follow Rambus
Company website: rambus.com
Rambus blog: rambus.com/news-events/blog
Twitter: @rambusinc
LinkedIn: www.linkedin.com/company/rambus
Facebook: www.facebook.com/RambusInc

About Cryptography Research

Cryptography Research, a division of Rambus Inc., is a leader in semiconductor security research and development. Established by internationally renowned cryptographer Paul Kocher, Cryptography Research develops and licenses innovative technologies in areas including tamper resistance, content protection, anti-counterfeiting, network security, and financial services. Over eight billion security products are made each year under license from Cryptography Research. Security systems designed by Cryptography Research scientists and engineers protect hundreds of billions of dollars in commerce annually. Additional information is available at cryptography.com.

About Rambus Inc.

Rambus brings invention to market. Our customizable IP cores, architecture licenses, tools, services, and training improve the competitive advantage of our customer’s products while accelerating their time-to-market. Rambus products and innovations capture, secure and move data. For more information, visit rambus.com.

Rambus logo