At Rambus, we create cutting-edge semiconductor and IP products, spanning memory and interfaces to security, smart sensors and lighting.
Found 3458 Results
Implementing CXL™ 2.0 Interconnect Solutions
https://go.rambus.com/implementing-cxl2-interconnect-solutions#new_tabCompute Express Link™ (CXL) has evolved rapidly since its launch in 2019 and is slated for debut in the next generation of server platforms coming later this year. While it builds on the same physical layer as PCI Express, CXL implements unique features at the controller level to enable memory cache coherency between a host […]
Memory Bandwidth for AI/ML Races Higher with HBM3
https://go.rambus.com/rds-memory-bandwidth-races-higher-with-hbm3#new_tabWith the insatiable need for higher bandwidth in state-of-the-art AI/ML training and HPC, the HBM standard has been on a rapid pace of improvement. The newly standardized HBM3 generation doubles the data rate to 6.4 Gb/s that offers up to 819 GB/s of memory bandwidth between an accelerator and a single HBM3 DRAM device. Memory […]
Advancing Computing in the Accelerator Age
https://go.rambus.com/advancing-computing-in-the-accelerator-age#new_tabMoore’s Law has been the force that has shaped the modern world enabling chips with billions of transistors. Yet today, when we need Moore’s Law more than ever, the rate of semiconductor scaling is slowing, requiring system architects to take a new approach to continue the pace of performance gains in computing. Heterogenous compute architectures […]
Rambus RT-640 Road to ISO26262 Certification
https://go.rambus.com/rambus-rt-640-road-to-iso26262-certification#new_tabModern vehicles incorporate an increasing number of complex integrated circuits. Failures in automotive systems can lead to damage to property, injury or loss of life. Ensuring the reliability of electronic systems is crucial, and the ISO26262 standard documents the requirements for determining automotive functional safety. This whitepaper details the process for how Rambus achieved the […]
CXL™ 3.0 Turns Up Scalability to 11
https://www.rambus.com/blogs/cxl-3-0-turns-up-scalability-to-11/The CXL™ Consortium (of which Rambus is a member) has now released the 3.0 specification of the Compute Express Link™ (CXL) standard. CXL 3.0 introduces compelling new features that promise to increase data center performance, scalability and TCO. CXL has evolved rapidly from its introduction in 2019. The 1.0/1.1 specification enabled prototyping of CXL solutions. […]
Rambus Appoints Desmond Lynch as Chief Financial Officer
https://www.rambus.com/rambus-appoints-desmond-lynch-as-chief-financial-officer/Brings over 20 years of finance and semiconductor experience SAN JOSE, Calif. – August 1, 2022 – Rambus Inc. (NASDAQ: RMBS), a provider of industry-leading chips and silicon IP making data faster and safer, today announced it has appointed Mr. Desmond Lynch to the position of senior vice president and chief financial officer. Mr. Lynch will be responsible for […]
Rambus Reports Second Quarter 2022 Financial Results
https://www.rambus.com/second-quarter-2022-financial-results/Delivered Q2 revenue and earnings at the high end of guidance Achieved record quarterly product revenue driven by memory interface chips Expanded DDR5 portfolio with introduction of companion chips for server and client memory modules Generated $56.5 million in cash from operations SAN JOSE, Calif. – August 1, 2022– Rambus Inc. (NASDAQ:RMBS), a provider of […]
Desmond Lynch
https://www.rambus.com/leadership/desmond-lynch/Desmond Lynch SVP & Chief Financial Officer Desmond Lynch joined Rambus in 2020 and has served as Chief Financial Officer since August 2022, where he is responsible for the global finance organization, with responsibility for financial management, planning, tax, treasury, controls, and reporting. Previously, he served as the Vice President of Finance for Rambus. Prior […]
Bulletproofing PCIe-based SoCs with Advanced Reliability, Availability, Serviceability (RAS) Mechanisms
https://www.rambus.com/blogs/bulletproofing-pcie-based-socs-with-advanced-reliability-availability-serviceability-ras-mechanisms/1. Introduction As silicon manufacturing process nodes keep shrinking and transistors get smaller, System-on-Chip (SoC) are increasingly subject to failures due to changing external conditions such as temperature, EMI, power surges, Hot Plug events, etc. The transition to PCIe 5.0 and 6.0 with increasing PCIe signaling speeds (32GT/s and 64GT/s) also increases the risk of errors due to constricted […]
DDR5 SPD Hub Product Brief
https://go.rambus.com/ddr5-spd-hub-product-brief#new_tabThe Rambus SPD Hub with Internal Temperature Sensor (SPD Hub) SPD5118-G1B enables DDR5 Registered DIMMs (RDIMMs), Load Reduced DIMMs (LRDIMMs), Non-Volatile memory DIMMs (NVDIMMs), Unbuffered DIMMs (UDIMMs) and Small-Outline DIMMs (SODIMMs).
